RM-4U8G
A barebone server platform engineered as a single thermal and power system
Six things that matter.
4U envelope
Eight GPU slots
Integrated liquid cooling
No motherboard lock-in
EK-engineered cooling
Platform model
Three design decisions worth calling out.
EATX-compatible · 4U · 19" rack
Closed integrated liquid loop · in-chassis radiator
Redundant high-density PDU · platform-level distribution
From starter footprint to production maximum.
Reference configurations · examples drawn from real customer builds. Final BOM is specified per deployment — LM TEK supplies the platform; the GPUs, CPUs, memory, and storage are sourced separately and can vary.
| Tier | GPU | CPU | RAM | Storage | Use case |
|---|---|---|---|---|---|
| Modest start | 2× NVIDIA RTX 6000 Ada | 1× AMD EPYC 9354 (32-core) | 256 GB DDR5 ECC | 2× 3.84 TB NVMe | Workstation crossover · departmental AI · single-team inference |
| Mid-tier | 4× NVIDIA RTX A6000 | 2× AMD EPYC 9474F (48-core) | 512 GB DDR5 ECC | 4× 3.84 TB NVMe | Lab / research group · multi-user inference · light fine-tuning |
| Production maximum | 8× NVIDIA H200 NVL | 2× Intel Xeon Platinum 8580 | 1 TB DDR5 ECC | 8× 7.68 TB NVMe | Enterprise inference · production fine-tuning · multi-tenant |
Everything in the loop, from the same catalogue.
The cooling loop inside RM-4U8G is built from the same components that ship into LM TEK workstation deployments. Same materials discipline, same pressure envelope, same supplier.
Browse the full catalogue →Full datasheet
| Form factor | 4U · 19" rack chassis |
| Dimensions (L × W × H) | 760 × 482 × 178 mm |
| Net mass (barebone) | 38 kg · approximate |
| GPU slots | 8 × full-height PCIe Gen 5 |
| GPU power envelope | Up to 700 W per slot · sustained |
| CPU sockets supported | AMD SP5 · Intel LGA 4677 · per chosen motherboard |
| Motherboard form factors | EATX · EEB · server reference |
| Memory slots | Per chosen motherboard · typically 24 × DDR5 RDIMM |
| Storage bays | 8 × NVMe U.2 · hot-swap · front access |
| Networking | Per chosen motherboard · OCP 3.0 mezzanine supported |
| Cooling type | Integrated liquid · in-chassis closed loop |
| Coolant materials stack | Nickel-plated copper · stainless steel · POM Acetal · EPDM seals |
| Working pressure | 2 500 Pa |
| Max pressure | 30 000 Pa (with EK-Pro PRM) · 75 000 Pa (otherwise) |
| Operating temperature range | 5 – 35 °C ambient · 5 – 60 °C coolant |
| Power supply | Redundant 3000 W · 80 PLUS Titanium · hot-swap |
| Power distribution | Platform-level PDU · independent of motherboard VRM |
| Country of origin | Slovenia |
Top & side view, in millimetres
Envelope drawing for rack-integration work. All measurements in mm. Use this to verify clearance to adjacent rack units, to the rack rear, and to any cable-management hardware before specifying.
Compatibility
Shipped contents
Specifying RM-4U8G into a deployment?
Tell us what is going inside the chassis — board, CPUs, GPUs, memory, storage — and what the deployment envelope looks like. LM TEK engineering will confirm compatibility, validate the cooling capacity for your GPU choice, and produce an integration spec before any quote conversation starts.